如何搞定Underfill胶水固化填充不足
文章出处： 人气：：21
随着细间距CSP/PoP等集成电路封装越来越广泛地应用于各种电子产品中，此类元件的细小焊点可靠性就越来越受到大家的重视了。在热应力或机械应力作用下，精细的焊点可能出现断裂失效问题。现在业界普遍采用Underill工艺以降低应力对焊点的影响，但Underfill在操作过程中又可能出现一些制程问题...
PRODUCT DESCRIPTION
LOCTITE ECCOBOND UF 3915 provides the following product
characteristics:
Technology Epoxy
Appearance Black liquid
Cure Snap Cure or Heat cure
Product Benefits ● Halogen free
● One component
● Snap curable
● Fast flow
● High Tg
● Easy rework
● High fracture toughness
● Excellent thermal cycle performance...
PRODUCT DESCRIPTION
LOCTITE ECCOBOND UF 3810 provides the following product
characteristics:
Technology Epoxy
Appearance Black liquid
Product Benefits ● One component
● Fast cure at moderate temperatures
● High Tg
● Halogen free
● Compatible with most Pb-free solders
● Stable electrical performance in
temperature humidity bi...
第一部分 化学品及企业标识
化学品中文名称: LOCTITE ECCOBOND UF 3808 又名 Hysol UF3808 6OZ (-20DC) EN/CH
推荐用途: 环氧树脂
企业信息： 汉高（中国）投资有限公司
张衡路928号 201203 中国上海市浦东新区 中国
电话：+86-21-2891 8000
生效日期: 01.04.2016
应急信息： 应急电话：+86 532 8388 9090 (24小时)。
...
作者:底部填充胶 | 分类:
TDS&MSDS | 浏览:13,925 views
A well-orchestrated PCB design and assembly plan is required to successfully implement techniques such as underfill in next generation OEM embedded consumer and mobile designs.
Two distinct market sectors in embedded systems are driving a trend to ever smaller components that do more, do it more reliably, and do it while withstandin...
作者:admin | 分类:
Article | 浏览:7,467 views
PRODUCT DESCRIPTION
3508NH provides the following product characteristics:
Technology Epoxy
Appearance Black
Cure Reflow
Product Benefits ● One component
● Reflow curable
● Eliminates post-reflow dispenses and
cure steps
● Reworkable
● Halogen free
● Improves mechanical reliability of
hand-held devices
Application Underfil...
PRODUCT DESCRIPTION
3128NH provides the following product characteristics:
Technology Epoxy
Appearance Black viscous liquid
Components One component - requires no mixing
Product Benefits ● One component, requires no mixing
● Low temperature cure
● Low halogen content
Cure Heat Cure
Application Underfill
Typical Assembly
Appl...
ES501
Underfill Resin
ES 501 is an underfill resin designed to improve adhesive strength of devices during mechanical stress, whilst
not degrading the thermal cycle performance. Its high flexibility provides enhanced repairability and is ideal for
high volume assembly processes.
• Fast, void-free underfill of area array devices; s...
1. CHEMICAL PRODUCT AND COMPANY IDENTIFICATION
1) PRODUCT NAME : UNIQUE 3075BHF
2) CHEMICAL FAMILY : FORMULATED EPOXY RESIN
3) TYPICAL APPLICATIONS : UNDERFILL
3) MANUFACTURER : - NAME : HI-TECH KOREA CO., LTD. - ADDRESS : # 191-7, SUWORAM-RI, SEOTAN-MYEON, PYONGTAEK-SI, KYEONGGI-DO, KOREA - TELEPHONE NUMBER : +82-31-665-50...
1. PRODUCT DESCRIPTION
UNIQUE 3075BHF is a fast flow, reworkable, single component epoxy glue that is designed to improve the attachment strength of CSP & BGA or Flip Chip devices during mechanical stress testing such as drop and bending testing.
2. KEY FEATURES
* Excellent Chemical Resistance and Water-Proofing * Excellen...
