新型可返工环氧底部填充料的合成和性能
童凌杰，王鹏，肖斐
（复旦大学材料科学系，上海200433）
摘要：合成了两种分别含有叔酯键和叔醚键的环氧化合物EP – 1 和EP – 2，其结构通过红外光谱、氢核磁共振谱及环氧当量测定等方法得到证实。EP – 1 与已有商品ERL – 4221 以环氧物质的量比1：1 混合组成EP – 3。EP – 2 和EP – 3 用酸酐类固化剂HMPA 固化。TGA 测试表明它们具有理想的起始热分解温度（ IDT = 210 ～ 220℃），显著低于现在普遍应用的环氧底部填充料ERL -4221（IDT = 310℃）。它们的粘结强度和玻璃化转变温度Tg在返工温度（225℃）老化数分钟后迅速降低，可以满足当前微电子倒装芯片封装对可返修工艺的要求。
关键词：可返工；底部填充料；环氧树脂；倒装芯片；热降解
中图分类号：TB34；TQ436 文献标识码：A
Synthesis and properties of novel controlled thermally degradable epoxy resin for electronic packaging
TONG Ling – jie，WANG Peng，XIAO Fei
（Department of Materials Science，Fudan University，Shanghai 200433，China）
Abstract：The synthesis，formulation and characterizations of two new diepoxides were reported，one diepoxide contains tertiary ester（EP – 1）and the other contains tertiary ether linkages（EP – 2）. Both compounds were characterized with 1H – NMR and FT – IR and formulated into underfill materials with an anhydride as hardener and a 2 – methylimidazole as catalyst. A dual – epoxy system（EP – 3）was also formulated with the tertiary ester diepoxide and a conventional aliphatic diepoxide，ERL – 4221，using the same hardener and catalyst. The thermogravimetric analysis（TGA）reveals that the cured EP – 2 and EP – 3 had obviously lower thermal decomposition onset temperature（around 215℃）than ERL – 4221 （310℃）. The shear strength and glass transition temperatures of these novel diepoxides decreas quickly upon being aged at 225℃. The unusual thermal degradable properties make these compounds a potential use as reworkable underfill for flip – chip application.
Key words：reworkable；underfill materials；diepoxide；flip – chip；thermal degradation
下载附件查看全文：
新型可返工环氧底部填充料的合成和性能 (1.1 MB, 1 次)
您没有权限下载此文件。
