汉高LOCTITE UNDERFILL 3500
时间:2016年02月22日 05:25:58 | 作者:底部填充胶 | 分类:TDS&MSDS | 浏览:4,414 views
3500™ underfill cures quickly at low temperature to minimize thermal stress to other components and provide rapid device throughput. When cured, it provides excellent protection for solder joints against mechanical stress, such as shock, drop, and vibration common in hand-held devices. The material is also reworkable, allowing for an expanded process window and recovery of high-cost substrates and PWBs.
……
download： Hysol-underfill-3500-tds
