汉高LOCTITE UNDERFILL 3505 TDS
时间:2016年02月25日 00:46:44 | 作者:底部填充胶 | 分类:TDS&MSDS | 浏览:4,019 views
LOCTITE® 3505™ is a one part, heat curable epoxy. It is designed for use as a reworkable CSP(FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices. It cures rapidly on exposure to heat. It is designed to give excellent protection from failure due to mechanical stress. The low viscosity allows filling in gaps under CSP or BGA.
LOCTITE® 3505™ provides the following product characteristics:
Download： Loctite-underfill-3505-tds
