表面張力與接觸角變化對覆晶封裝底部填膠流動的影響
表面張力與接觸角變化對覆晶封裝底部填膠流動的影響
王永元、張榮語*
清華大學化工系
In this work, the capillary flow, which is influenced by the surface tension of encapsulant and the contact angle between encapsulant, bumps and substrate, of dispensing process for flip chip underfill is discussed by theoretical and numerical analysis. The velocity field, melt-front shape and melt-front position are solved using a method base on 3D Collocated Cell-Centered Finite Volume Method. Most studies before neglect the dynamic contact angle of encapsulant and the influence of bumps. By applying different dynamic contact angle model parameters, we found that the contact angle changes during flow will influence the flow time greatly. And by applying different boundary condition at bump walls, we found that bump will influence both the flow time and the melt-front. So, the influence of dynamic contact angle and bumps con not be neglected. By applying suitable model parameters and wall boundary conditions, the flow behavior of Flip-Chip encapsulation is simulated correctly in this work.
本研究主要是以理論及3維數值分析探討覆晶封裝的點膠式底部填膠(Dispensing Process for Flip Chip Underfill)過程中，封膠(Encapsulant)表面張力及封膠和基板、錫球間接觸角變化(Dynamic Contact Angle)對流動的影響。以往對於底部填膠流動的研究，多忽略封膠的動態接觸角以及錫球在厚度方向對於流動的影響，本研究藉由設定不同的動態接觸角模式參數，發覺封膠的接觸角變化影響充填時間甚鉅，並進一步對錫球牆面設定不同的接觸角，發覺錫球的存在會同時影響充填時間和充填圖形，因此動態接觸角和錫球的影響不可忽略。藉由設定適當的模式參數與牆壁面條件，本研究已可準確地模擬底部填膠過程。
下载论文查看：
表面張力與接觸角變化對覆晶封裝底部填膠流動的影響 (795.3 KB, 5 次)
您没有权限下载此文件。
