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覆晶底膠封裝考慮慣性效應
覆晶底膠封裝考慮慣性效應
Flip-Chip Underfill Packaging considering Inertia Effect
林肇民
電機工程學系
摘要：本文主要是利用經轉動產生之離心力增加覆晶底膠的流動充填速率，進而改善底膠充模費時的現象。底膠流動主要的驅動力為慣性離心力和毛細現象其大小決定於角速度的大小及距旋轉中心之距離遠近。由推導之方程式可得到三種不同的模式，毛細流模式，固定接觸角模式及變化接觸角模式。其解之型式顯示接觸角、平均流速及固液交接面位置是流動間距、旋轉速度及迴轉半徑之函數。其結果顯示利用迴轉慣性效應可以有效地提昇毛細充填速度。
關鍵詞：毛細現象、慣性效應、底膠流動、覆晶封裝。
ABSTRACT：This paper describes how the use of inertia forces induced by the rotation of a working disk may be adopted to increase the fill rate of the flip-chip packaging process and thereby reduce the process cycle time. It is shown how the driving forces resulting from the inertia effect are determined by the angular speed of the rotating disk
and by the location of the fixed chip relative to the disk center. The capillary flow model, the constant contact angle model, and the varying contact angle model are compared under a specified set of process conditions. The calculated flow behavior results indicate that the relationship between the contact angle, the average fluid velocity and the liquid-air interface position depends upon the gap size, the rotational velocity of the disk and the rotation radius. The present results confirm that rotation of the working disk leads to an increased underfill capillary flow rate, which is beneficial in reducing the production cycle time of the flip-chip packaging process.
KEYWORDS: capillary, inertia, underfill, flip-chip packaging
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