如何搞定Underfill胶水固化填充不足
文章出处： 人气：：21
随着细间距CSP/PoP等集成电路封装越来越广泛地应用于各种电子产品中，此类元件的细小焊点可靠性就越来越受到大家的重视了。在热应力或机械应力作用下，精细的焊点可能出现断裂失效问题。现在业界普遍采用Underill工艺以降低应力对焊点的影响，但Underfill在操作过程中又可能出现一些制程问题...
ietiantang
2009-09-02 15:20
DSP点underfill膠后烘烤出現氣泡
DSP四周點underfill膠體經過抽真空后，在110°烘烤30分鐘，DSP四周出現氣泡問題。
DSP是SN9C230CJG-LF(46-PIN QFN)6.5*4.5*0.85MM SONIX(SERTEK)
不知道哪位能否幫忙解決
ietiantang
2009-09-02 16:42
怎么没人看啊，来人帮帮我...
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Rework of Underfilled Device
Underfills protect the active surface of the die of flip chips, BGA ad CSP package types while improving their reliability by distributing stress away from the solder interconnects. This increases the performance of products in meeting drop, shock and bend criteria. Newer underfills are specifically des...
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Introduced by IBM in the 1960s, a flip chip is a computer chip that is attached to a motherboard with solder instead of tiny wires. Underfill is a polymer placed under a flip chip to fill the space between the chip and the motherboard. It protects the active surface of the flip chip from being damaged. If a flip chip is removed from th...
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Underfill Jetting & Dispensing
Underfill is used in a wide variety of packages and board level assemblies. Flip chip in package, direct chip attach on boards, stacked die packages, and various BGA assemblies are places where underfill is being used in production today. The "part" to be underfilled can be either a die or the BGA su...
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Underfill Rework
Underfilled components are used in consumer electronic products (mobile devices, portable computers etc.), in the automotive industry (sensor modules, engine control units etc.) or whenever flip chips are incorporated in products with maximum miniaturization.
An underfilled chip contributes to an improved ove...
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DESCRIPTION
Underfill 623 is a non-odorous, low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill 623 offers excellent capillary action for flat, fast and complete spread. Underfill 623 offers superior reliability through high Tg, low CTE,...
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With today’s advancements in component packaging, dispensing has become a more critical part of the electronics manufacturing line. Consequently, the increasing popularity of such processes as flip chip underfilling has led to complications in the industry, primarily because it has added a process step involving strict attentio...
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Micro-gap Filling for TSV Package and Simple Underfill Process for TSV Stacking
IP.com Prior Art Database Disclosure (Source: IPCOM)
Disclosure Number IPCOM000171102D dated 09-Jun-2008
Originally published in The IP.com Journal v8n6A
Disclosed by: Siemens AG
Country: Germany
Copyright: Qimonda 2008
Related People...
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Reworkable Underfill Encapsulant for BGA's
Apr 27, 2004
CN-1453 Before Removal
After BGA Removal and Site Clean-up
EAST HANOVER, NJ � Zymet has introduced a new reworkable BGA underfill encapsulant, CN-1453. It is a silica filled version of the company�s earlier CN-1432, so i...
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