Nano-Underfills for High-Reliability Applications in Extreme Environments
Pradeep Lall, Saiful Islam, Jeff Suhling, Guoyun Tian
Auburn University
Department of Mechanical Engineering
and NSF Center for Advanced Vehicle Electronics
Auburn, AL 36849
Tele: (334) 844-3424
E-mail: lall@eng.auburn.edu
Abstract
Silica particles are...
作者:admin | 分类:
Papers | 浏览:7,546 views
刘海龙[1,2] 杨少华[2] 李国元[1]
[1]华南理工大学电子与信息学院,广州510640 [2]工业和信息化部电子第五研究所电子元器件可靠性物理及其应用技术国家级重点实验室,广州510610
摘 要:堆叠封装（package-on-package,PoP）是一种先进的三维封装。首先基于有限元分析方法对PoP封装进行建模,对PoP封装在潮湿环境中进行了吸湿和解吸附分析。研究了吸湿膨胀引...
Dr. Ken Gilleo ET-Trends gilleo@ieee.org
Abstract
Underfill is today’s polymer magic that enables the increasingly popular 2nd generation Flip Chip - lower cost assembly on organic substrate. This paper will provide a basic understanding of the chemistry of underfills and the physical properties that are important to their succes...
作者:admin | 分类:
Papers | 浏览:5,881 views
最近遇到一些cornerbond用途的客户，上网找了找发现现在关于cornerbond和edgebond的资料还是挺多的，提供一个资料供大家学习。
Corner Bonding of CSPs: Processing and Reliability
Guoyun Tian, Yueli Liu, R. Wayne Johnson,
Pradeep Lall, Mike Palmer, & Nokib Islam
Laboratory for Electronics Assembly &
Packaging – Auburn University
162 Brou...
作者:风间飞猪 | 分类:
Papers | 浏览:10,319 views
“No Flow” Underfill Reliability is Here
Michael A. Previti
Cookson Semiconductor Packaging Materials
200 Technology Drive Alpharetta, GA 30005 www.cooksonsemi.com
Abstract
Properly formulated no flow underfills decrease manufacturing time and cost of producing flip chip packages. Flip Chip strives to become the ultimate...
作者:admin | 分类:
Papers | 浏览:6,837 views
表面張力與接觸角變化對覆晶封裝底部填膠流動的影響
王永元、張榮語*
清華大學化工系
In this work, the capillary flow, which is influenced by the surface tension of encapsulant and the contact angle between encapsulant, bumps and substrate, of dispensing process for flip chip underfill is discussed by theoretical and numerical an...
作者:admin | 分类:
Papers | 浏览:8,870 views
覆晶封裝之流動及固化分析
Simulation of Flowing and Curing in Flip-Chip Packaging
林肇民[1] 王建順[2] Chao-Ming Lin Jiann-Shuenn Wang
吳鳳技術學院 電機工程系Department of Electrical Engineering, Wu-feng Institute of Technology
摘要：本研究是以射出成型之數值模擬方式探討不同之流道型式及入射波前造成覆晶封裝製程中封裝膠體流動及固化...
作者:admin | 分类:
Papers | 浏览:7,587 views
底填封膠製程參數優化研究
黃乾怡 陳重任
華梵大學工業工程與經營資訊研究所
jayhuang@cc.hfu.edu.tw ；m9101009@cat.hfu.edu.tw
摘要
為了提昇電子產品的可靠度，製造過程中通常會針對電路板上的重要元件進行底填封膠（Underfill）點膠製程。本研究中乃是以玻片模擬底填封膠在元件基板與印刷電路板間隙層內的流動行為。在實驗過程中，考量底填封膠的黏稠度...
作者:admin | 分类:
Papers | 浏览:9,479 views
By Dr. Ken Gilleo & David Blumel
Alpha Metals/Cookson, 250 Culver Ave.
Jersey City, NJ 07304
Abstract
Most Flip Chip assemblies require underfillto bestow reliability that would otherwise be ravished by stress due tothermomechanical mismatch between die and substrate. While underfill can beviewed as “polymer magic” and the ke...
作者:admin | 分类:
Papers | 浏览:5,612 views
Reliability concerns in flip chip packaging pivot on the underfill material used, apart from other factors. Hinge your selection of the right underfill on its properties such as CTE, viscosity, flow characteristics, modulus, and adhesion.
By Dr. Ignatius J. Rasiah Material Scientist Johnson Matthey (Singapore)
As IC packages ...
作者:admin | 分类:
Papers | 浏览:5,978 views
