FC- BG A/ CS P底 层填充液体环氧封装材料
陶志强 王德生 李海燕 李洪深 范琳 杨士勇.
中科院化学所工程塑料国家重.x实验室高技术材料研究室， 北京100080)
[摘 要 】FC-BGA/CSP用底层填充料(Underfill) 是一种填充球型硅微粉的低粘度液体环氧封装料，主要用于填充倒装坏芯片(Flip chip, FC)与基板之间的狭缝，增强凸焊点与基板的连接强度，密...
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Processing and Reliability of CSPs withUnderfill
Jing Liu & R. Wayne Johnson
Laboratory for Electronics Assembly &Packaging– Auburn University
162 Broun Hall, ECEDept.
Auburn, AL 36489 USA
Erin Yaeger, Mark Konarski & Larry Crane
Loctite Corporation
1001 Trout Brook Crossing Rocky Hill, CT06067 USA
Abstract
The...
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Review of CSP and Flip Chip Underfill Processes and When To Use the Right Dispensing Tools For Efficient anufacturing
By Steven J. Adamson
Asymtek, A Nordson Company
2762 Loker Ave. West, Carlsbad, CA 92008
tel: 1-760-930-7274
http://www.asymtek.com
Abstract：
The need to underfill chip scale package (CSP) and Flip Chip device...
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Transforming Flip Chip Back Into a CSP with Reworkable Wafer-Level Underfill
Ken Gilleo - ET-Trends
David Blumel Alpha Metals
The Packaging Revolution
Flip Chip vs. CSP
Why Underfill?
Classes of Underfill
Final Generation FC; a CSP
Conclusions
download pdf file: [download id="39"]
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Advances in Fast Underfill of Flip Chips
Alec J. Babiarz and Horatio Quinones
Asymtek, 2762 Loker Avenue West, Carlsbad, CA.
760-930-3311
Abstract：
One of the barriers to mainstream use of flip chips was the underfill process. The time required for capillary flow out of the underfill was perceived as a process bottleneck in t...
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FAST UNDERFILL PROCESSES FOR LARGE TO SMALL FLIP CHIPS
ABSTRACT
The biggest conceptual impediment to capillary underfill isthe perception that the process is a major bottleneck in the production line. However, in the last few years, great strides have been made in equipment, materials and dispensing processes that have removed un...
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NATASHA B. RACHELL
Physics Teacher
Lithonia High School
GEORGIA TECH MATERIALS SCIENCE AND ENGINEERING
ACKNOWLEDGEMENTS
DR. C.P. WONG
(HEAD OF DEPT.)
DR. XIAO FEI
(MY MENTOR)
SOME DIFFERENT BRANCHES THAT MATERIALS SCIENCE AND ENGINEERING AFFECT:
MICROELECTRONICS:THIS DIVISION WORKS ON MAKING MICROELECTRONIC UNITS ...
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Flip-Chip is an interconnection technique of advanced electronic device. The advantages of Flip-Chip are high I/O counts, short electronic signal path and small size. Most of electronic device of Flip-Chip are packaged by underfill that the encapsulant was driven by capillary force into the space between the chip and substrate. Underf...
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STUDY ON THE NANOCOMPOSITE UNDERFILL FOR FLIP-CHIP APPLICATION
A Thesis Presented to The Academic Faculty by Yangyang Sun
In Partial Fulfillment
of the Requirements for the Degree
Doctor of Philosophy in the
School of Chemistry and Biochemistry
Georgia Institute of Technology
December, 2006
TABLE OF CONTENTS
ACKNOWLEDGEM...
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The application of underfill materials to fill up the room between the chip and substrate is known to substantially improve the thermal fatigue life of flip chip solder joints. Nowadays, no-flow underfill materials are gaining much interest over traditional underfill as the application and curing of this type of underfill can be undert...
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