PRODUCT DESCRIPTION
LOCTITE® 3549 is a fast flow, low temperature cure, reworkable epoxy underfill for BGA and CSP devices. It exhibits high adhesion to flexible and rigid circuit substrates. LOCTITE® 3549, when fully cured, provides excellent protection for the solder joints against induced stresses, increasing both drop test and tem...
“SUMIMAC” ECR-9945K is designed for secondary underfill and is suitable for CSP or LGA etc.
ECR-9945K is one component epoxy resin with low-temperature fast curing, has a good reworkability and good flowability.
......
3. Reworking(Removing resin)
3.1. Heat the part until solder melting point.
3.2. Parts are peeled off by twee...
NAMICS XSUF1577-24 TDS
Repairable BGA/CSP Reinforcing Encapsulant
dowload pdf file : [download id="21"]
Modern hand held devices and the trend toward thinner, less rigid PCBs are driving the demand for improved shock resistance and increased electronic device reliability.
Hysol® package level underfill encapsulants meet stringent JEDEC testing requirements and are compatible with the high temperature processing required for lead-free ...
REWORKABLE CSP and BGA UNDERFILL ENCAPSULANT
CN-1703 is a reworkable underfill encapsulant for CSP and BGA encapsulation that cures quickly at low temperature. It is capable of flowing quickly across distances of 750 mils and greater. This encapsulant exhibits excellent adhesion to organic substrates.
TYPICAL PROPERTIES
Color Cloudy...
PRODUCT DESCRIPTION
FP4526™ provides the following product characteristics:
Technology Epoxy
Appearance Blue
Product Benefits
• Low viscosity
• Fast flow
• Excellent wettability
• Excellent adhesion
• Ideal for high reliability
Applications • Hi-Pb and Pb-free applications
Filler Weight, % 63
Cure Heat cure
Application Und...
PRODUCT DESCRIPTION
Hysol® FP4548FC is a high purity, liquid epoxy encapsulant designed as an underfill for flip chip devices. FP4548FC features low coefficient of thermal expansion properties and improved toughness. When fully cured, FP4548FC forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal c...
PRODUCT DESCRIPTION
UF3801 provides the following product characteristics:
Technology Epoxy
Appearance Black liquid
Cure Heat cure
Product Benefits
• One component
• Reworkable
• Fast cure at moderate temperatures
• Minimal stress on other components
• High Tg
• Compatible with most Pb-free and halogen-free solders
• Stable...
今天有位朋友向我咨询到乐泰的一款underfill产品，型号是3517，据说是用在sharp的PDA类产品上面，我对3513了解多一些，因为碰到的手机客户用此款的较多，公司的DU901和DU902也都是针对3513同类应用的。于是去官方网站下载了一份看了看！看上去与3513还比较类似，不过固化的温度似乎可以更低一些，时间也稍微长一些，还有就是Tg点似乎要高一些，但返修方式好像是一...
PRODUCT DESCRIPTION
UF3800 provides the following product characteristics:
Technology Epoxy
Appearance Black liquid
Cure ...
