Electrolube ES501 Underfill Resin TDS
时间:2016年04月15日 02:48:09 | 作者:底部填充胶 | 分类:TDS&MSDS | 浏览:7,903 views
ES501
Underfill Resin
ES 501 is an underfill resin designed to improve adhesive strength of devices during mechanical stress, whilst
not degrading the thermal cycle performance. Its high flexibility provides enhanced repairability and is ideal for
high volume assembly processes.
• Fast, void-free underfill of area array devices; snap curable
• Re-workable and highly flexible; allows efficient repair work to be completed
• Excellent adhesion to substrates; maintains strength when thermally cycled
• Good electrical characteristics; high insulation resistance
download file：Electrolube-ES501-Underfill Resin-TDS-EN
