Fill Patternand Particle Distribution of Underfill Material
时间:2012年03月11日 11:52:18 | 作者:admin | 分类:Article | 浏览:6,982 views
Fill Patternand Particle Distribution of Underfill Material
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 27, NO. 3, SEPTEMBER 2004 493 Fill Patternand Particle Distribution ofUnderfill Material Yue Huang, David Bigio, and Michael G. Pecht , Fellow, IEEE Abstract— Underfillscan dramatically improve flip chip reliab ility. However, the fillers used in someunderfills can be …
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IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 27, NO. 3, SEPTEMBER 2004 493 Fill Patternand Particle Distribution ofUnderfill Material Yue Huang, David Bigio, and Michael G. Pecht , (1.9 MB, 5 次)
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