HENKEL HYSOL 3508NH Cornerfill TDS
时间:2016年04月20日 00:06:46 | 作者:底部填充胶 | 分类:TDS&MSDS | 浏览:7,777 views
PRODUCT DESCRIPTION
3508NH provides the following product characteristics:
Technology Epoxy
Appearance Black
Cure Reflow
Product Benefits ● One component
● Reflow curable
● Eliminates post-reflow dispenses and
cure steps
● Reworkable
● Halogen free
● Improves mechanical reliability of
hand-held devices
Application Underfill
Typical Applications Reworkable CSP/BGA cornerfill
3508NH is designed to cure during Pb-free solder reflow while
allowing self-alignment of IC components. It can be pre-applied
to the board at the corners of the pad site using a standard
SMA dispenser.
DOWNLOAD FILE:HENKEL-HYSOL-3508NH-Cornerfill-TDS-EN
貌似是由underfill衍生出来的一款cornerfill胶水
