HENKEL HYSOL UNDERFILL UF3707 TDS
时间:2016年03月10日 06:11:00 | 作者:底部填充胶 | 分类:TDS&MSDS | 浏览:3,748 views
PRODUCT DESCRIPTION
UF3037 provides the following product characteristics:
Technology Epoxy
Appearance Black liquid
Product Benefits ● One component
● Reworkable
● Fast cure at low temperatures
● Compatible with most Pb-free and
halogen-free solders
● Very good impact and thermal cycle
resistant performance
Cure Heat cure
Application Underfill
Typical Package
Application
Chip scale packages and BGA
UF3037 reworkable epoxy underfill is designed for CSP and
BGA applications. It cures quickly at low temperatures to
minimize stress to other components, and when cured provides
excellent mechanical stress protection for solder joints.
据说是SHARP手机在用的型号！
