HENKEL LOCTITE 190851(LPD221) UNDERFILL TDS
时间:2016年03月22日 03:05:40 | 作者:底部填充胶 | 分类:TDS&MSDS | 浏览:4,742 views
PRODUCT DESCRIPTION
LOCTITE(TM) Product LPD-221 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA. It cures rapidly on exposure to heat. It is designed to give excellent protection from failure due to mechanical stress. The low viscosity allows filling in gap under CSP or BGA.
PROPERTIES OF UNCURED MATERIAL
Typical Value
Chemical Type Epoxy
Appearance Black liquid
Specific gravity @ 25°C 1.1
Viscosity @ 25°C, mPa.s 4,100
HAAKE viscometer, PK1, 2°
Constant shear rate @ 36 1/s
download files:HENKEL-LOCTITE-190851(LPD221)-TDS-EN
