HENKEL LOCTITE 190967 UNDERFILL TDS EN
时间:2016年03月24日 03:42:10 | 作者:底部填充胶 | 分类:TDS&MSDS | 浏览:5,107 views
LOCTITE® 190967™is a single component, epoxy adhesive developed as reworkable CSP underfill. It cures rapidly at low temperature on exposure to heat. It is designed to give excellent protection of assembled devices from failure due to physical impact and/or thermal cycling. The low viscosity allows filling in gaps under CSP or BGA. The low viscosity allows easy filling in gap under CSP or BGA. TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25 °C 1.16 Viscosity, Cone & Plate, mPa·s (cP): Temperature: 25 °C, Shear Rate: 36 s -1 3,000 to 6,000LMS Flash Point – See MSDS
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