HENKEL LOCTITE 3128NH TDS
时间:2016年04月18日 08:20:08 | 作者:底部填充胶 | 分类:TDS&MSDS | 浏览:9,398 views
PRODUCT DESCRIPTION
3128NH provides the following product characteristics:
Technology Epoxy
Appearance Black viscous liquid
Components One component – requires no mixing
Product Benefits ● One component, requires no mixing
● Low temperature cure
● Low halogen content
Cure Heat Cure
Application Underfill
Typical Assembly
Applications
Memory cards and CCD/CMOS
3128NH edgebond material is designed to add reliability to chip
scale packages and other electronic components. It is a low
temperature cure adhesive ideal for use on heat sensitive
components.
DOWNLOAD FILES:HENKEL-LOCTITE-3128NH-TDS-EN
应该是乐泰低温胶3128的一个衍生产品，但作为传统underfill用途貌似有些牵强！
