HENKEL LOCTITE ECCOBOND UF 3810
PRODUCT DESCRIPTION
LOCTITE ECCOBOND UF 3810 provides the following product
characteristics:
Technology Epoxy
Appearance Black liquid
Product Benefits ● One component
● Fast cure at moderate temperatures
● High Tg
● Halogen free
● Compatible with most Pb-free solders
● Stable electrical performance in
temperature humidity bias
● Reworkable
● Room temperature flow capability
Cure Heat cure
Application Underfill
Typical Package
Application
Chip scale packages and BGA
LOCTITE ECCOBOND UF 3810 reworkable epoxy underfill is
designed for CSP and BGA applications. It cures quickly at moderate
temperatures to minimize stress to other components. When cured,
this material provides excellent mechanical properties to protect solder
joints during thermal cycling.
