HENKEL LOCTITE ECCOBOND UNDERFILL 3915 TDS
时间:2016年03月02日 01:15:39 | 作者:底部填充胶 | 分类:TDS&MSDS | 浏览:5,106 views
PRODUCT DESCRIPTION
LOCTITE ECCOBOND UF 3915 provides the following product
characteristics:
Technology Epoxy
Appearance Black liquid
Cure Snap Cure or Heat cure
Product Benefits ● Halogen free
● One component
● Snap curable
● Fast flow
● High Tg
● Easy rework
● High fracture toughness
● Excellent thermal cycle performance
● Compatible with most Pb-free solders
● Stable electrical performance under
thermal/humidity bias
Application Underfill
Typical Package
Application
WLCSP and Flip chip devices
LOCTITE ECCOBOND UF 3915 reworkable underfill is specially
designed for flip chip device applications.
据说是给苹果7开发的， 大家可以看看
