Hysol FP4548FC UNDERFILL TDS
PRODUCT DESCRIPTION
Hysol® FP4548FC is a high purity, liquid epoxy encapsulant designed as an underfill for flip chip devices. FP4548FC features low coefficient of thermal expansion properties and improved toughness. When fully cured, FP4548FC forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance. This material is specially suited for flip-chip devices requiring improved crack/fracture resistance and no-clean flux compatibility.
TYPICAL APPLICATIONS
Encapsulant for flip chip devices
PROPERTIES OF UNCURED MATERIAL
Color Gray
Filler content, (%, ignition), (ITM3A) 65
Flow rate (500 mil flow 2 mil gap, 100°C) 30 seconds
Shelf Life @-40°C, (-40°F), months 9
Viscosity (ASTM D2393) Brookfield Cone & Plate @ 25°C (77°F) CP52, Speed 20, Cp 20,000
CURE SCHEDULE
Recommended Cure 30minutes @ 165°C
Alternate Cure 90minutes @ 150°C
(Enhanced Performance)
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