HYSOL UNDERFILL UF3800 TDS
PRODUCT DESCRIPTION
UF3800 provides the following product characteristics:
Technology Epoxy
Appearance Black liquid
Cure Heat cure
Application Underfill
Typical Package Application Chip scale packages and BGA
Product Benefits
• One component
• Reworkable
• Fast cure at moderate temperatures
• Minimal stress on other components
• High Tg
• Compatible with most Pb-free and halogen-free solders
• Stable electrical performance in Temperature Humidity Bias
UF3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25°C, mPa Physica MCR100, Spindle CP50-1, 1000S-1 375
Specific Gravity 1.13
Pot Life @ 25ºC, days 3
Shelf Life @ -20°C, months 9
Flash Point – See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule ≥8 minutes @ 130°C
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