LOCTITE ECCOBOND UF 3915
PRODUCT DESCRIPTION
LOCTITE ECCOBOND UF 3915 provides the following product
characteristics:
Technology Epoxy
Appearance Black liquid
Cure Snap Cure or Heat cure
Product Benefits ● Halogen free
● One component
● Snap curable
● Fast flow
● High Tg
● Easy rework
● High fracture toughness
● Excellent thermal cycle performance
● Compatible with most Pb-free solders
● Stable electrical performance under
thermal/humidity bias
Application Underfill
Typical Package
Application
WLCSP and Flip chip devices
LOCTITE ECCOBOND UF 3915 reworkable underfill is specially
designed for flip chip device applications.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield CP51, 25 °C, mPa·s (cP):
Speed 20 rpm 5,500
Thixotropic Index 1.1
Specific Gravity, Density Cups, g/ml 1.66
Work Life @ 25°C, hours 24
Shelf Life @ -40 °C, days 270
Flash Point – See SDS
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