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LOCTITE underfill 3549
PRODUCT DESCRIPTION
LOCTITE® 3549 is a fast flow, low temperature cure, reworkable epoxy underfill for BGA and CSP devices. It exhibits high adhesion to flexible and rigid circuit substrates. LOCTITE® 3549, when fully cured, provides excellent protection for the solder joints against induced stresses, increasing both drop test and temperature cycle performance of the device.
TYPICAL APPLICATIONS
Removable CSP or BGA underfill.
PROPERTIES OF UNCURED MATERIAL Typical Value
Color Black
Filler Content, %, ignition (ITM3A) NA
Specific Gravity 1.3
Viscosity @ 25°C, (77°F) (ITM2A) Cone & Plate, (Brookfield) Spindle 52, Speed 20, Cp 2,200
Recommended Curing Conditions
5 minutes @ 120°C
3 minutes @ 130°C
1 minutes @ 150°C reflow
Optional Reflow Cure (for Drop Test Reliability)
2 minutes @ 130°C
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loctite 3549 TDS (96.4 KB, 2 次)
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