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LOCTITE UNDERFILL Product 3513
PRODUCT DESCRIPTION
LOCTITE(TM) Product 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA. It cures rapidly on exposure to heat. It is designed to give excellent protection from failure due to mechanical stress. The low viscosity allows filling in gap under CSP or BGA.
PROPERTIES OF UNCURED MATERIAL
Typical Value
Chemical Type Epoxy
Appearance Pale yellow
Specific gravity @ 25°C 1.15
Viscosity @ 25°C, mPa.s 4,600
HAAKE viscometer, PK1, 2°
Constant shear rate @ 36 1/s
Pot life @ 23°C, h < 48
RECOMMENDED CURING CONDITIONS
20 minutes at 120°C bondline temperature
30 minutes at 100°C bondline temperature
Note: Sufficient time must be added to allow the bond location to reach the desired cure temperature. Curing profiles should be developed for each device.
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