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Namics Under-fill Qualification Report
RPT083 (v1.0.1) August 27, 2007
Table of Contents
Overview
Qualification Objective
Reliability Test Conditions and Results
Qualification Data
Overview
This report summarizes the reliability testing results that were obtained to qualify Namics under-fill material that will be used in SPIL’s Flip-Chip package assembly.
Qualification Objective
The objective of this qualification is to qualify Namics under-fill material for the flip-chip packages that are already in production.
Reliability Test Conditions and Results
The qualification vehicles were selected from several different product families as well as several different package sizes and pin counts for reliability tests. Table 1 provides a summary of the qualification.
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