“No Flow” Underfill Reliability is Here
“No Flow” Underfill Reliability is Here
Michael A. Previti
Cookson Semiconductor Packaging Materials
200 Technology Drive Alpharetta, GA 30005 www.cooksonsemi.com
Abstract
Properly formulated no flow underfills decrease manufacturing time and cost of producing flip chip packages. Flip Chip strives to become the ultimate micro-package by delivering the highest density and best performance in a cost-effective manner. Yet, underfill-processing issues could still curtail the full implementation of this elegantly simple solution. While the concept of pre-dispensed, or “no flow”, underfill flux has been offered as the best answer to the productivity bottleneck, reliability has been questioned. This work evaluates the reliability of no flow underfill materials and performs failure mode analyses of flip chip structures using no flow underfills. Three test vehicles and three reliability tests were used to evaluate and analyze the reliability performance of commercially available no flow underfills.
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