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SIGNIFICANT PERFORMANCE IMPROVEMENTS
BY EDWARD IBE, KARL LOH, JING-EN LUAN, AND TONG YAN TEE
Underfill typically is not used to encapsulate ball grid arrays (BGAs) or chip scale packages (CSPs) at the board level. However, the use for fine-pitch BGAs and CSPs in handheld devices, such as cell phones and PDAs, in automotive electr...
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In today’s electronic devices such as smartphones there are numerous complex engineering components. Expanding on its portfolio of advanced underfill materials, Henkel has developed Loctite UF3810, a new underfill technology that provides extremely high reliability while also enabling easier reworkability as compared to previous ge...
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Underfill Rework
Underfilled components are used in consumer electronic products (mobile devices, portable computers etc.), in the automotive industry (sensor modules, engine control units etc.) or whenever flip chips are incorporated in products with maximum miniaturization.
An underfilled chip contributes to an improved ove...
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DESCRIPTION
Underfill 623 is a non-odorous, low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill 623 offers excellent capillary action for flat, fast and complete spread. Underfill 623 offers superior reliability through high Tg, low CTE,...
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With today’s advancements in component packaging, dispensing has become a more critical part of the electronics manufacturing line. Consequently, the increasing popularity of such processes as flip chip underfilling has led to complications in the industry, primarily because it has added a process step involving strict attentio...
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Fill Patternand Particle Distribution of Underfill Material
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 27, NO. 3, SEPTEMBER 2004 493 Fill Patternand Particle Distribution ofUnderfill Material Yue Huang, David Bigio, and Michael G. Pecht , Fellow, IEEE Abstract— Underfillscan dramatically improve flip chip reli...
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Micro-gap Filling for TSV Package and Simple Underfill Process for TSV Stacking
IP.com Prior Art Database Disclosure (Source: IPCOM)
Disclosure Number IPCOM000171102D dated 09-Jun-2008
Originally published in The IP.com Journal v8n6A
Disclosed by: Siemens AG
Country: Germany
Copyright: Qimonda 2008
Related People...
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Reworkable Underfill Encapsulant for BGA's
Apr 27, 2004
CN-1453 Before Removal
After BGA Removal and Site Clean-up
EAST HANOVER, NJ � Zymet has introduced a new reworkable BGA underfill encapsulant, CN-1453. It is a silica filled version of the company�s earlier CN-1432, so i...
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Underfill Flow as Viscous Flow Between Parallel Plates Driven by Capillary Action - Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY-PART ...
Abstruct- Epoxy underfill is often required to enhance the reliability of...
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Article | 浏览:6,425 views
