BGA Underfill Alternative
Back when RoHS was just an idea, one of the big concerns was the fear of mechanical reliability with lead-free BGAs. A lot of study went into the solder mixes and it's now history, but there is still some concern. Especially in hi-shock prone applications. Sometimes I recommend that the engineer go alon...
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Underfill
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Encapsulants and Potting Compounds (219 Suppliers)
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circu...
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September 25, 2003 - Hysol® FP4580 low stress liquid epoxy prevents cracking and delamination of chip's inner layers. It works on copper/low k flip chip laminate packages up to 50 x 50 mm with over 4,000 solder bumps. When fully cured, product forms rigid, low warp seal that dissipates stress on solder joints and extends thermal cyclin...
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DESCRIPTION http://www.aimsolder.com.au/index.php/adhesives/107-620-underfill-epoxy
Underfill 620 is a fast flowing liquid epoxy designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill 620 is designed to enhance solder joint reliability by minimizing induced stresses and providing impr...
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Underfill Encapsulants http://www.masterbond.com/industries/underfill-encapsulants
Master Bond’s epoxy underfill compounds feature high glass transition temperatures and resistance to shock.Designed to improve reliability, Master Bond’s line of epoxy underfill compositions offer excellent underfill to die passivation as wel...
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Guideline for Selection and Application of Underfill Material for Flip Chip and other Micropackages
Draft 7
Underfill Adhesives for Flip Chip Applications Task Group (5-24f)
J-STD-030
Guideline for Selection and Application of Underfill Material
for Flip Chip and other Micropackages
Draft 7 – Dec 2000
Table of Contents
1 ...
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Underfill Update: NUF, MUF, WUF, and Other Stuff
Dr. Ken Gilleo, Cookson Electronics
<kgilleo@ieee.com>
Background
Many decades ago, the Flip Chip was born of necessity in New York, of all places. IBM was pursuing the optimum process for connecting chips to the outside world. The big mainframe computer makers have always b...
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Adhesion and Debonding of Underfill to SiNx passivation
Motivation:
The overwhelming trend in the microelectronics industry today is to strive toward smaller feature dimensions on each chip. With the increased number of devices on one integrated circuit, there is a need for packaging that can accommodate the growing population of...
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CSP and BGA Underfill
http://www.nordson.com/en-us/divisions/asymtek/solutions/PCB-Assembly/Pages/CSP-and-BGA-Underfill.aspx
Non-contact jet dispensing is ideal to underfill CSPs, BGAs, and PoP packages on boards. Nordson ASYMTEK's jetting systems automatically manage the critical processes related to underfilling with Con...
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PROCESS/APPLICATIONS > UNDERFILL
Underfill is the process of applying a specially engineered epoxy to fill the area between the die and the carrier. Underfill materials are designed to control the stress on the solder joints. This stress is caused by either the difference in thermal expansion between the silicon die and the carrier...
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