LOCTITE® 190967™is a single component, epoxy adhesive developed as reworkable CSP underfill. It cures rapidly at low temperature on exposure to heat. It is designed to give excellent protection of assembled devices from failure due to physical impact and/or thermal cycling. The low viscosity allows filling in gaps under CSP or BGA. The...
PRODUCT DESCRIPTION
LOCTITE(TM) Product LPD-221 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA. It cures rapidly on exposure to heat. It is designed to give excellent protection from failure due to mechanical stress. The low viscosity allows filling in gap under CSP or BGA.
...
RP-113178 Pick and Place Underfilm
Features
Enhances CSP and BGA solder joint reliability
Reduces cost by combining pick and place plus soldering
in one heating pass (no dispensing).
No capital expense or equipment required
Compatible with existing lead and Pb-free materials and
reflow profiles.
Air or nitrogen reflow co...
产品特点：
提高 CSP 和 BGA 焊点的可靠性。在加热过程中，通过贴装加
焊接相结合的方式降低成本(无需点胶工序)。
无资本支出，设备和额外场地的需求。
生产员工最少化以降低劳动成本。
与现有无铅焊接材料的回流温度曲线一致，无需额外调整。
空气或氮气保护回流兼容。
无需线路板预烘
100% 可返工
符合RoHS及无卤的环保要求
AOI设备易于识别
应用...
1、Scope
2、Cpk Data
3、Description and Application
3.1 Description
3.2 Application
4、Material Requirements
4.1 Material Properties
4.2 Converted Film Requirements
4.3 Factory Automation and Identification
4.4 Material Storage, Packaging and Shipment
4.5 User Manufacturing Environments
downlo...
作者:底部填充胶 | 分类:
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Why Underfill/Underfilm
Solder joint Cracking due to Pb-free solder application
Must apply underfill or underfill film to enhance the solder reliabilities
Thermal Bond UF Advantage
• Efficiency Application
1. Reflowable thermal bonding film are easily chip on the circuit board use standard SMT machine and reflow prof...
作者:底部填充胶 | 分类:
Article | 浏览:5,063 views
PRODUCT DESCRIPTION
UF3037 provides the following product characteristics:
Technology Epoxy
Appearance Black liquid
Product Benefits ● One component
● Reworkable
● Fast cure at low temperatures
● Compatible with most Pb-free and
halogen-free solders
● Very good impact and thermal cycle
resistant performance
Cure Heat cure
A...
BGA Package Underfilm for Autoplacement
Jan Danvir
Tom Klosowiak
NIST-ATP Acknowledgment
AcknowledgmentProject Brief Microelectronics Manufacturing Infrastructure (October 1998)Wafer-Scale Applied Reworkable Fluxing Underfill for Direct Chip AttachDevelop new materials and technology needed to allow existing integrated-circuit ...
作者:底部填充胶 | 分类:
Article | 浏览:3,469 views
PLACE-N-BOND Partial UnderfilmTechnology
Alltemated, Inc.
Arlington Heights, IL
United States of America
Steveh@alltemated.com
Dave.Skupien@ActionIR.com
Randy.Temple@ActionIR.com
Testing and Implementation
Reliability analysis (Underfilmvs. Bare)
To further review the capability of the Partial UnderfilmTechnology, we condu...
作者:底部填充胶 | 分类:
Papers | 浏览:3,398 views
世界首款焊点包裹加固材料 -SMT256和SMT266环氧树脂助焊剂
YINCAE ADVANCED MATERIALS, LLC
英凯高级材料有限公司
怎样做到焊点包裹保护 – SMT256/266
SMT256和SMT266都有从焊盘与焊锡球上去除金属氧化物的功效， 并有助于焊点的更好形成
在回流焊接过程中，SMT256和SMT266能固化形成3-D网络式聚合物包裹在焊点周围
SMT256和SMT266在焊接...
作者:底部填充胶 | 分类:
Product | 浏览:3,856 views
