PLACE-N-BOND Partial UnderfilmTechnology
时间:2016年03月08日 03:10:53 | 作者:底部填充胶 | 分类:Papers | 浏览:3,387 views
PLACE-N-BOND Partial UnderfilmTechnology
Alltemated, Inc.
Arlington Heights, IL
United States of America
Steveh@alltemated.com
Dave.Skupien@ActionIR.com
Randy.Temple@ActionIR.com
Testing and Implementation
Reliability analysis (Underfilmvs. Bare)
To further review the capability of the Partial UnderfilmTechnology, we conducted testing similar to the underfilltesting that has been presented by various studies. First, a test vehicle was designed that contained one board mounted with ten 132 pin BGAs.
A standard .004” solder screen was first placed. Five of the BGAs would receive no additional support and five would receive a boundary pattern of partial underfilmof .008” thickness.
downlaod files:Partial UnderfilmTechnology
