Reworkability of Underfill Materials (for CGA)
时间:2012年01月13日 14:39:27 | 作者:admin | 分类:Papers | 浏览:5,709 views
Reworkability of Underfill Materials
NEPP Deliverable
Jong Kadesch
Harry Shaw
10/10/01
Outline
• Objective
• Procurement
– underfill material, and two rigid boards (one with pins, and one
without pins)
• Assembly Process
– Mate two rigid boards using conductive epoxy
– Column Grid Array (CGA) interconnection
– Fill with underfill around CGA interface
• Test Plan
– temperature cycles
– Destructive Physical Analysis (DPA)
• Removal Method Experiment
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