Three Bond Technical-Flat Packages Mounting Adhesives
Flat Packages Mounting Adhesives
Both consumers and industry are demanding that electronic equipment integrated with IC or LSI be made smaller and lighter, and have enhanced features. Products such as personal computers, video players, video cameras, cellular phones, and audio equipment, as well as automotive electronic products, are becoming smaller while retaining the same features, or are adding features if they remain the same size.
To make a piece of electronic equipment “lighter, thinner, and smaller,” the LSI package mounted on it also needs to be smaller. As a result, the LSI package has evolved from a DIP (Dual In-line Package) with pins for insertion, to a flat package that can be installed on the board. The package has also become smaller, to match the narrow pitch of the terminals.
This issue introduces different types of flat packages, and the adhesive that Three Bond has developed to fix or connect the flat package to the board.
Introduction
1. Flat packages and connection methods
2. Instant adhesive and curing accelerator for temporary fixing of the flat package
3. BGA/CSP mounting adhesive
4. Flip-chip mounting adhesive
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