Transforming Flip Chip Back Into a CSP with Reworkable Wafer-Level Underfill
时间:2012年01月23日 04:30:58 | 作者:admin | 分类:Papers | 浏览:5,931 views
Transforming Flip Chip Back Into a CSP with Reworkable Wafer-Level Underfill
Ken Gilleo – ET-Trends
David Blumel Alpha Metals
The Packaging Revolution
Flip Chip vs. CSP
Why Underfill?
Classes of Underfill
Final Generation FC; a CSP
Conclusions
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