Underfill for High-end Application
时间:2012年02月15日 06:48:33 | 作者:admin | 分类:Article | 浏览:7,455 views
Hitachi Chemical Co.,Ltd Semiconductor Materials Div.
FC-BGA
CUF (solder bump) NUF (solder bump)
Stacked CSP
CUF (solder bump) NUF (solder bump) NCP (Au bump)
Stacked Die
TH Electrode
CUF (High flow) NUF (Voidless)
CUF:Capillary flow underfill NUF:Non flow underfill
Working on Wonders
Flip Chip Trend
Silicon chip trend
Bump count Silicon performance Bump pitch Die gap Large die Low-k Thin die Pb free bump Solder joint
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