Underfills and Encapsulants
Underfills and Encapsulants
| Epoxy based underfill and encapsulant products from United Adhesives are for semiconductor applications such as to attach chip-on-board, bare die, BGA, flip-chip, CSP, etc, or to under-fill the gap between die /chip and substrate, or to encapsulate dies, chips, components, or powder devices.
They provide various superior features such as: – Excellent capillary flow capability. – High Tg formulation for high temperature stability – Very low CTE formulation to minimize the thermal mismatch – High voltage insulation formulation – Strong bond to FR4, ceramic, polyamide, metals, and other difficult materials – Good dielectric property. Low current leakage
Thermally conductive underfills are also available. |
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